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| EMIF10-LCD01F2 IPADTM 10 line EMI filter and ESD protection Main product characteristics: Where EMI filtering in ESD sensitive equipment is required : LCD for Mobile phones Computers and printers Communication systems MCU Boards Flip-Chip (25 bumps) Description The EMIF10-LCD01F2 is a 10 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV. Order code Part Number EMIF10-LCD01F2 Marking FL Figure 1. Pin Configuration (bump side) 5 I5 I10 GND 4 I4 I9 GND 3 I3 I8 GND 2 I2 I7 GND 1 I1 I6 GND A B C D E Benefits EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consuming: < 6 mm2 Lead free package Very thin package: 0.69 mm High efficiency in ESD suppression on input pins (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging. GND GND GND Input O10 O5 O9 O4 O8 O3 O7 O2 O6 O1 Figure 2. Basic Cell Configuration Low-pass Filter Output Ri/o = 100 Cline = 35pF Complies with following standards: IEC 61000-4-2 level 4 input pins 15 kV 8 kV (air discharge) (contact discharge) MIL STD 883G - Method 3015-7 Class 3 TM: IPAD is a trademark of STMicroelectronics. January 2007 Rev 3 1/8 www.st.com 8 Characteristics EMIF10-LCD01F2 1 Table 1. Symbol Tj Top Tstg Characteristics Absolute Maximum Ratings (Tamb = 25 C) Parameter Junction temperature Operating temperature range Storage temperature range Value 125 -40 to + 85 -55 to +150 Unit C C C : Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM RI/O Cline Rt / Ft Electrical Characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic resistance Peak pulse current Series resistance between Input and Output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V 90 @ 0 V bias Induced rise and fall time 10-90% at 26 MHz frequency signal V = 1.9 V (Rt / Ft input 1 ns, 50 impedance generator) 100 28 8(1) Min. 6 Typ. 8 Max. 10 500 110 35 Unit V nA pF ns IPP VCL VBR VRM IRM IR VF V I IF 1. guaranteed by design Figure 3. 0 -10 -20 -30 -40 S21(dB) attenuation measurement Figure 4. dB Analog cross talk measurement dB 10 -10 -30 -50 -70 F(Hz) F(Hz) 1.0 M 10.0 M 100.0 M 1.0 G 10.0 G -50 0.1 M 1.0 M 10.0 M 100.0 M 1.0 G 10.0 G -90 0.1 M 2/8 EMIF10-LCD01F2 Characteristics Figure 5. ESD response to IEC 61000-4-2 Figure 6. (+15 kV air discharge) on one input and on one output ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input and on one output Vin Vin Vout Vout Figure 7. Line capacitance versus applied voltage Figure 8. Rise time 10-90% measurements with 1.9 V signal at 26 MHz frequency (50 generator) CLine(pF) 35 30 25 20 15 10 5 0 0.0 1.0 VLine(V) 2.0 3.0 4.0 5.0 Figure 9. Fall time 10-90% measurements with 1.9 V signal at 26 MHz frequency (50 generator) 3/8 Characteristics Figure 10. Aplac model EMIF10-LCD01F2 EMIF10-LCD01F2 model Ground return Figure 11. Aplac parametersl ZRZ structure aplacvar Remif10low 100 aplacvar Cemif10flow 17.5pF Bumps aplacvar Lbump 50pH aplacvar Rbump 20m aplacvar Cbump 1.5pF Bulk aplacvar Rsub 100m Gnd connections aplacvar Rgnd 100m aplacvar Lgnd 200pH aplacvar Cgnd 0.15pF BV = 7 CJO = Cemif10low IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = 0.015 VJ = 0.6 TT = 50n 4/8 EMIF10-LCD01F2 Ordering information scheme 2 Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500m, Bump = 315m = 2: Leadfree Pitch = 500m, Bump = 315m = 3: Leadfree Pitch = 400m, Bump = 250m yy - xxx zz Fx 3 Package information Figure 12. Flip-Chip Dimensions 500 m 50 500 m 50 315 m 50 650 m 65 2.42 mm 50m 2.42 mm 50m 250 m 40 Figure 13. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Figure 14. Footprint recommendation Copper pad Diameter: 250m recommended, 300 m max E xxz y ww Solder stencil opening: 330 m Solder mask opening recommendation: 340 m min for 315 m copper pad diameter 5/8 Ordering information Figure 15. Flip-Chip tape and reel specification Dot identifying Pin A1 location 4 +/- 0.1 EMIF10-LCD01F2 O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: More packing information is available in the application notes: AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 8 +/- 0.3 ST E ST E ST E xxz yww xxz yww xxz yww 4 +/- 0.1 User direction of unreeling 4 Ordering information Ordering code EMIF10-LCD01F2 Marking FL Package Flip-Chip Weight 9.3 mg Base qty 5000 Delivery mode Tape and reel (7") 6/8 EMIF10-LCD01F2 Revision history 5 Revision history Date 14-Feb-2005 17-Mar-2005 30-Jan-2007 Revision 1 2 3 Initial release. Capacitance Cline specification changed from 47 pF (typ) to 28 pF (typ) and 35 pF (max). Reformatted to current standards. Reduced die size and updated Figures 3 and 4. Changes 7/8 EMIF10-LCD01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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